A method of producing low-loss multi-component wafers

The present invention relates to a method for producing a multi-component wafer, in particular a MEMS wafer. The inventive process in this case comprises at least the steps of: Providing a bond wafer (2), wherein at least a surface portion (4) of the bond wafer (2) is formed by an oxide layer, Providing a donor wafer (6), wherein the donor wafer (6) is thicker than the bond wafer (2), Contacting the donor wafer (6) bring the space formed by the oxide film surface portion (4) of the bond wafer (2), Forming a multi-layer assembly (8) by bonding of the donor wafer (6) and the bond wafer (2) in the region of the contact, Disposing or producing a voltage generation layer (10) on at least an exposed planar surface (12) of the multi-layer arrangement (8), Thermal applying the voltage generating layer (10) for generating mechanical stresses within the multilayer assembly (8), wherein the tension in the by the donor wafer (6) formed portion of the multi-layer arrangement (8) are so large that in the donor wafer (6) forms a crack through which the donor wafer (6) into a separation part (14) and a connecting part ( 16) is cleaved wherein the connecting part (16) remains on the bond wafer (2) and wherein the cleaved partition member (14) has a greater thickness than the connecting part (16).