Triangular Voltage Sweep (TVS) characterisation for Through-Silicon-Via (TSV) reliability
2016
We demonstrate the use of TVS for reliability characterization of TSV. TVS complements conventional methods of dielectric reliability characterization such as VBD and TDDB. TVS is used to study copper diffusion out of the TSV and the impact of TSV process on neighboring devices.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
5
References
1
Citations
NaN
KQI