Functional RDL of FOPLP by Using LTPS-TFT Technology for ESD protection Application

This study realized a functional RDL structure in FOPLP for the first time. It shows not only the potentials and advantages of small generation display factory to produce IC packaging by FOPLP in the future, but also a new concept of hetero-integration by combining display and RDL technologies. The ESD protection circuit formed by LTPS-TFT can discharge large than 0.5 A in a nano-second for protecting die to die I/Os of multi-chips in assembly process of RDL first packaging.