Thermal Characterization of 2.5D FCBGA for GPU Application

2.5D Integrated Circuit package is very important for high- performance applications. The shrinkage in package size, cost reduction and improving thermal performance are driving the development of 2.5D Integrated Circuit. The development of 2.5D technology faces the challenge of thermal path and new structure. The present study applied three-dimensional finite volume methods to simulate the thermal behavior and the allocation of hot spots in the 2.5D package. The results of molding analysis revealed that the thermal resistance between molding/non-molding and expose-die packaging would influence the manufacturability and reliability of the package. In order to reduce the thermal resistance of package and the die to die integration, a design monitoring the installation ratio between package and substrate were investigated. The results of simulation indicate that the power map is non-uniform. The hot spot occurs as the ratio of die/power is over 25 %. The designs of implementing a shielding of ASIC/HBM and interconnect structure of package/substrate improve the maximum power of 2.5D FCBGA about 35~40%. The results of numerical analysis indicate that the above mentioned advance 2.5D IC structure design would lead to better thermal dissipation. The enhancements in the thermal dissipation behaviors are ascribed to the thermal path and the appropriate hot spot location layout. The 2.5D Integrated Circuit package mechanism and the design guidance for engineering application will be presented and discussed in this paper.