Epitaxial layer transfer using thin film Sn soldering, suitable for hybrid integration in a coplanar technology

Hard solders have been used for over 35 years for high reliable die attach and include eutectic alloys of Au-Si, Au-Ge and Au-Sn, which have melting temperature of 383/spl deg/C, 361/spl deg/C and 280/spl deg/C respectively. This work presents a bonding technique that involves the use of a thin Sn layer (< /spl mu/m) as a soldering material between two surfaces having thin Au metallization. The technique has been applied for the integration of an epitaxial layer thin film A/sub III/B/sub V/ semiconductor device into a silicon coplanar waveguide technology suitable for high frequency applications.