Trends in microelectronics packaging and interconnection
1996
Functions and definitions of electronics packaging-along with product-oriented electronics packaging and interconnection technologies, including roadmap and packaging requirements for portable electronics in the year 2000, are reviewed. It has been determined that high-density packaging is the major product driving force in today's highly competitive electronics industry. Accordingly, major trends and developments in microelectronics packaging and interconnection are presented and discussed.
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