Transport measurements of heat dissipation in supported monolayer graphene

2012 
Graphene shows great potential for future electronic devices due to its high carrier mobility and thermal conductivity [1, 2]. An important consideration for such devices is thermal cooling of charge carriers. The use of large current densities results in over heating of charge carriers, and this power must be dissipated to avoid thermal breakdown of the graphene sheet [3]. The main cooling mechanisms are (1) direct transfer of heat to the metallic contacts forming the source and drain of the device via diffusion of electrons [4], (2) transfer of heat to the graphene lattice via scattering of electrons by acoustic phonons of the graphene sheet [5], and (3) transfer of heat directly to the underlying substrate via scattering of electrons by surface mode phonons of the substrate [6].
    • Correction
    • Source
    • Cite
    • Save
    • Machine Reading By IdeaReader
    7
    References
    0
    Citations
    NaN
    KQI
    []