Challenge of 12″ CIS CSP development, explore via finite element method

Sensor is expected being an important component in coming IoT era. CIS CSP solution has been wildly adopted for the secondary camera in a smart phone but majority stayed in 8″ T-contact CSP in the past years. The 12″ solution is more attractive due to its low cost to drive the supply chain moving forward. The major contribution came from the gross die gain based on the analysis result. 12″ CIS CSP is the critical path at this moment. In order to shorten development cycle time, finite element method is used to address the structure integrity from reliability point of view. The commercial software, ANSYS, is used to create the FEM model and conduct the parametric study.