Demonstration of a Hybrid Opto-Electronic Transmitter on SoI for Access Networks
2014
We present a hybrid integrated transmitter comprised of an InP/InGaAsP electro-absorption modulated laser (EML) electrically driven by a BiCMOS SiGe electronic circuit on 4-μm SoI substrate. The EML includes an electro-absorption modulator integrated together with a distributed feedback laser and a spot-size expander. The modulator driver is fabricated using the SiGe BiCMOS approach with 2.5 Vp-p nominal output swing. Both elements have been flip-chip mounted on a thick SoI board using 14-μm gold-tin bumps and employing a high accuracy flip-chip bonder. The photonic chip has a footprint of 7 mm 2 and consumes a power of 0.8 W. We test the device optically and electrically demonstrating error-free operation at 10 and 20 Gb/s.
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