Resin film for electronic devices, and electronic device

Provided is a resin film for electronic devices, which contains a resin containing a polymer, moisture-absorbing particles that are dispersed in the resin and have primary particle diameters of 200 nm or less, and a dispersant, and wherein the absolute value of the difference between the refractive index of the resin and the refractive index of the particles is 0.05 or less. The resin is preferably a thermoplastic resin, and is more preferably a thermoplastic elastomer. The polymer is preferably one or more copolymers selected from among aromatic vinyl compound-conjugated diene copolymers and hydrogenated aromatic vinyl compound-conjugated diene copolymers. Also provided is an electronic device which is provided with this resin film for electronic devices.