Viscosity modeling during epoxy resin cure

A model is presented that describes the changing melt viscosity of an epoxy laminating resin during its cure. The model incorporates chemical as well as physical factors. The predictions of the model are compared to experimental data using resin cured at several rates of heat-rise, and at a fixed heat-rise profile using resin preadvanced to different extents of reaction. Agreement is good, particularly at rapid heat-rise rates, typical of those used in production.