Laser Debonding for 2.5D, 3D and Emerging Advanced Packaging Solutions

In recent years temporary bonding has evolved to a widely used process technology as it is an enabling process for many products relyinnovel solutions are typically assessed on two key criteria which are a broad process window and cost effectiveness. Thus in this paper these criteria will be discussed in more detail for the case of UV laser debonding with respect to wafer level packaging. By temporary bonding the thin or to be thinned device wafer is bonded to a carrier wafer by an adhesive interlayer to provide sufficient mechanical support which is crucial for many downstream processes. In the past several different technologies have been studied and implemented. A major differentiation factor between the offered solutions is the debonding method, including separation processes at room or elevated temperatures. Nowadays a particular focus is on UV laser debonding as it offers several advantages, as the debonding process can be performed at room temperature with fast process times and force free separati...