A method for manufacturing a wafer template
2016
A method of manufacturing a semiconductor device includes providing a carrier wafer (110) and forming a semiconductor device layer (113) on the support wafer (110). After the front-side processing of the semiconductor device layer (113) of the wafer carrier (310) by cutting along a plane parallel to the semiconductor device layer (113) extending plane is removed.
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI