Micromirror Angle Dependence with Etchant Choice on Silicon Via Wet Etching

In creating mirrored silicon structures for micro-optics, the smoothness of the surface and etch rate are crucial parameters. We demonstrate a method of creating both 45° and 90° etch-planes from monocrystalline silicon for use as retro-reflective sidewalls in a microfluidic device. The technique uses the same photolithographic pattern orientation, but with two different etchants. Etching on direction in Si(100) with potassium hydroxide (KOH) gives vertical surfaces (where e.g. the high surface tension influences etching of crystallographic silicon planes), whilst tetramethylammonium hydroxide (TMAH) gives 45° sidewalls. We illustrate the use of these fabricated structures by creating arrays of micromirrors that enable an optical beam to be reflected parallel back and forth from 45° and −45° tilted vertical structures. This device has potential uses in optofluidic spectroscopic applications, where there is a need to increase the effective pathlength of a beam through a sample whilst keeping the device as small as possible.