Micro-pattern Corrosion Screening on Bimetallic Corrosion for Microelectronic Application

Abstract The continued miniaturization of the integrated circuit, leading to minute dimensions (  12) at Cu/Ru interface, caused by enhanced oxygen reduction reaction on Ru, is proposed to generate more NH 3 for sustaining fast Cu corrosion. Effects of different plasma chemistries like CF 4 , CF 4  + O 2 , CH 2 F 2 , C 4 F 8 and SF 6 on the Cu corrosion in tetramethylammonium hydroxide (TMAH) were also investigated. Plasma treatments using higher fluorine content gases showed higher Cu corrosion rate in TMAH. Benzotriazole showed limited corrosion inhibition to plasma treated Cu/Ru micro-patterns in pH 14 TMAH solution. Contrastingly, pyrazole demonstrated as an effective corrosion inhibitor suppressing Cu corrosion rate down to the desirable