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High-Frequency Transmission Characteristics of the Interconnects Stacked into the 3D IC Configuration
High-Frequency Transmission Characteristics of the Interconnects Stacked into the 3D IC Configuration
2011
Yoichiro Kurita
Norikazu Motohashi
Satoshi Matsui
Koji Soejima
Shuhei Amakawa
Kazuya Masu
Masaya Kawano
Keywords:
Electronic engineering
Three-dimensional integrated circuit
Materials science
Transmission (mechanics)
Optoelectronics
Correction
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