Soldering method of the solder paste and electronic components

In the cream solder obtained by kneading the flux Sn-Ag-Cu-based alloy, wherein the Sn-Ag-Cu alloy comprises a mixture of a first powder alloy and a second powder alloy, the first powder alloy, sn-Ag-based state diagram has a solid-liquid coexisting region, it is assumed that the amount of Ag than the eutectic composition (3.5 wt% Ag) is consisting of more predetermined amount of Ag, the second powder alloy, eutectic composition by shall consist of (3.5 wt% Ag) or eutectic smaller amount of Ag than near the first powder alloy composition, which has excellent strength and thermal stability, low cost a better bondability as a base for a Sn-Ag-Cu solder alloy, to provide a suitable high-temperature-side lead-free solder material which can correspond to the temperature-hierarchical bonding, soldering method of the electronic component.