A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications
2013
Recently Silicon Photonics has generated an outstanding interest for integrated optical communications. In this paper we describe a 300mm Silicon Photonics platform designed for 25Gb/s and above applications at the three typical communication wavelengths and compatible with 3D integration. Main process features and device results are described.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
71
Citations
NaN
KQI