Routing a glass substrate via laser induced plasma backward deposition of copper seed layer for electroplating

Abstract The pursuit of routing a transparent material has been a compelling challenge for decades. Inspired by the existing fabrication techniques of laser assisted deposition, a novel composite process combining laser induced plasma backward deposition (LIPBD) with succeeding electroplating was proposed for routing a glass substrate in a cost-effective way. With optimized laser processing parameters and electroplating process, a dense copper pattern with mass content of Cu as high as 98.41% was achieved, which also verified superior reliability and stability under the circulation ultrasonic cleaning and strip pulling test. The successfully fabricated micro-circuit on the glass substrate demonstrated that the simple but powerful LIPBD technique possesses the flexibility and feasibility on enormous potential applications in routing micro-circuits on glass substrate.