Bridging the infrastructure gap between traditional wire-bond and TSV semiconductor package technology

The challenge for today's mobile devices is that they will all be expected to support more advanced graphics processing. And to reinforce this factor the industry requires an exponential increase in processor-to-memory bandwidth. This paper will introduce two innovative semiconductor package technologies designed to address these challenges; the Bond-Via-Array (BVA™) package and Duel and Quad Face Down (xFD™) memory package. The BVA package is an ultra high-IO Package-on-Package (PoP) solution that significantly increases bandwidth to enable current and future smartphone and tablet features and the xFD package assembly process, furnishes a very low profile stacked-die memory variation developed for next generation high performance DRAM.