PCB substrate having supporting pattern and method of fabricating the same

A printed circuit according to the embodiment one substrate is the outer layer to place the upper and lower portions of the inner layer, the inner layer having a support pattern and the via pad patterns are arranged apart from each other in the lateral direction, and a circuit comprising a pattern layer, and the at least one the circuit includes a via connecting the pattern layer and the via pad patterns. The support pattern rigidity (stiffness) is excellent in comparison with the via pad patterns. The via pad pattern over at least two are electrically connected to each other by a via pad connection pattern disposed on the same plane.