Pulse energy packing effects on material transport during laser processing of \( \) silicon

The effects of energy pulse packing on material transport during single-pulse laser processing of silicon is studied using temporarily shaped pulses with durations from 50 to 150 ns. Six regimes of material transport were identified and disambiguated through energy packing considerations over a range of pulse durations. Energy packing has been shown to shift the interaction to energetically costlier regimes without appreciable benefit in either depth, material removal or crater morphology and quality.