Evaluation of a novel ultra small target technology supporting on- product overlay measurements
2012
Reducing the size of metrology targets is essential for in-die overlay metrology in advanced semiconductor
manufacturing. In this paper, μ-diffraction-based overlay (μDBO) measurements with a YieldStar metrology tool are
presented for target-sizes down to 10 × 10 μm 2 . The μDBO technology enables selection of only the diffraction
efficiency information from the grating by efficiently separating it from product structure reflections. Therefore, μDBO
targets -even when located adjacent to product environment- give excellent correlation with 40 × 160 μm 2 reference
targets. Although significantly smaller than standard scribe-line targets, they can achieve total-measurement-uncertainty
values of below 0.5 nm on a wide range of product layers. This shows that the new μDBO technique allows for accurate
metrology on ultra small in-die targets, while retaining the excellent TMU performance of diffraction-based overlay
metrology.
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