Adhesive film for semiconductor wafter having protection layer

PURPOSE: An adhesive film for back grinding of semiconductor wafer equipped with a surface-protective membrane having excellent cushionability is provided to enhance cutting properties and adhesive properties without damages on a surface protective film or a wafer. CONSTITUTION: An adhesive film for back grinding of semiconductor wafer equipped with a surface-protective membrane having excellent cushionability comprises an adhesive layer(4) which is welded on the semiconductor wafer and is spread on a single-side or both sides of the base film(5). The adhesive layer comprises a first acrylic copolymer having an average molecular weight of 1,200,000-3,000,000, a second acrylic copolymer which has the average molecular weight of 500,000-1,000,000, and a hardener. The adhesive layer is formed from a thermosetting adhesive composition which includes 5-20 parts by weight of the second acrylic copolymer for 100.0 parts by weight of the first acrylic copolymer.