Old Web
English
Sign In
Acemap
>
Paper
>
Development of Dicing Technique for Thin Semiconductor Substrate by Using Temporally Shaped Femtosecond Laser
Development of Dicing Technique for Thin Semiconductor Substrate by Using Temporally Shaped Femtosecond Laser
2003
Atsushi Yokotani
Yasunobu Kurogi
Naoyuki Matsuo
Hiroshi Sawada
Takafumi Ninomiya
Kousuke Kawahara
Kou Kurosawa
Keywords:
Wafer dicing
Laser
Substrate (electronics)
Electronic engineering
Femtosecond
Computer science
Integrated circuit
X-ray laser
Optics
Laser ablation
Correction
Source
Cite
Save
Machine Reading By IdeaReader
22
References
0
Citations
NaN
KQI
[]