Chip type solid electrolytic capacitor

The present invention discloses a chip type solid electrolytic capacitor, wherein the PCB comprises forming a cathode and an anode connected to the disc portion of the insulating plate, and the anode and cathode terminals are formed on the lower portion of the insulating plate. The anode and cathode terminals are respectively electrically connected to the anode bore and connected to the cathode plate through the via. Anodic bonding is formed on the anode land. A capacitor element having an anode lead and a cathode layer on which the PCB is mounted, wherein the welded connection to the anode lead connected to an anode member and the cathode layer is connected to the cathode plate is connected electrically through a conductive adhesive. The resin to cover the outer side of the PCB and an upper portion of the capacitor element. The anode terminal and the cathode terminal, respectively, and also having a drop-stepped outer surface is covered with the resin part along the periphery of at least some portion of the formation.