Study of Laser Trimming and Cutting of Printed Circuit Board by using UV Laser with Nanosecond Pulse Width

Resistance trimming and cutting processes of printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also laser-based application system with high flexibility and complex has been designed and adopted power controller, auto beam size control, auto-focusing and control program developed for ourselves. The function of each module shows that they can be reliable for industrial equipments. Resistance trimming method used a plunge and double cut process with spot size beam. Results show that double cut process is more effective to control resistance trimming in precision than plunge cut process.