Support for manufacturing LED and method for encapsulating high-power white light LED

The invention discloses a support for manufacturing an LED and a method for encapsulating a high-power white light LED. The method comprises the following steps of: performing injection molding and wire bonding on a metal support; coating fluorescent powder locally by adopting an embankment method, wherein the colloid embankment at the periphery of chips is prepared from the colloid through the scribing function of an automatic dispenser, the colloid mixed with the fluorescent powder is in the embankment, and the thickness of fluorescent powder gluewater is determined according to a ratio of the fluorescent powder to the gluewater; putting on a lens, performing glue injection, and curing in a roaster; and cutting a circuit board to obtain the high-power LED. The method can improve the uniformity of the light and color of the white light LED; the embankment mode controls the thickness of the colloid at the periphery of the chips accurately, so that the effect of light mixing of the white light in every direction is controlled, and nonuniform yellow hue, blue hue and the like do not exist.