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Effect of Post-Annealing Conditions on Cu-Cu Wafer Bonding Characteristics
Effect of Post-Annealing Conditions on Cu-Cu Wafer Bonding Characteristics
2009
Eun-Jung Jang
Young-Bae Park
Sarah Pfeiffer
Bioh Kim
Thorsten Matthias
Seungmin Hyun
Hak-Joo Lee
Keywords:
Nuclear magnetic resonance
Thermocompression bonding
Annealing (metallurgy)
Physics
Adhesion
Wafer bonding
Molecular physics
Composite material
Condensed matter physics
post annealing
Correction
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