Process Design of the Component Mix of 01005 and Land Grid Array on a PCB

In current industrial electronics manufacturing, miniaturized devices and a variety of different device package shapes on one printed circuit board (PCB) are a particular challenge. In this paper, the highly miniaturized 01005 and Land Grid Array (LGA) devices are investigated in a mix on a PCB. Both parts have their own challenges in the manufacturing process, which were examined as a combination in this paper. The aim was to find an optimal production process design in order to produce high quality solder joints for all components. Another special feature is that the manufacturing process was investigated on a specially designed demonstrator under practical conditions on a surface-mounting technology (SMT) production line of the company Cicor RHe Microsystems GmbH. From the theoretical influencing factors, the influencing factors with the greatest significance within a practical manufacturing process were specifically selected. Using the demonstrator PCB and an experimental matrix, the most stable process parameters for the 01005 components and LGAs were found. The results show that solder paste with a larger grain size type 4 is suitable for LGAs. In contrast, for 01005 components, grain size type 5 is the optimum choice in the stencil printing process. For the component mix, a compromise has to be found in the process design to handle the miniaturized 01005 package and the LGAs. This compromise has been successfully demonstrated in this paper. This provides a stable manufacturing process for assemblies with 01005 components and LGAs.