Conductive and non-magnetic adhesive tape and processing method thereof

A conductive and non-magnetic adhesive tape is characterized by sequentially comprising a copper foil or aluminum foil substrate, a conductive and non-magnetic adhesive film and a release layer from top to bottom, wherein the conductive and non-magnetic adhesive film comprises components of an acrylic resin pressure-sensitive adhesive, electrolytic copper powder and a curing agent. A processing method of the conductive and non-magnetic adhesive film comprises steps as follows: step one, the acrylic resin pressure-sensitive adhesive, the electrolytic copper powder and the curing agent are taken; step two, the acrylic resin pressure-sensitive adhesive is stirred at a high speed, the curing agent and the electrolytic copper powder are added, and stirring is performed continuously; step three, the mixture is left to stand until bubbles are not generated, and the conductive and non-magnetic adhesive film is prepared. The processing method of the adhesive tape comprises steps as follows: step one, the release layer is positioned, an adhesive is released after the conductive and non-magnetic adhesive film is well adjusted, the release layer is uniformly coated with the adhesive film, the release layer penetrates through an electrical heating oven and is baked for 1-3 min, and the film is formed; and step two, the baked film and the copper foil or aluminum foil substrate are attached to form a roll material. According to the conductive and non-magnetic adhesive tape and the processing method thereof, electric wave interference and electronic information leakage can be effectively inhibited, harm of electric waves to an electronic part or a human body is prevented while penetration and work of useful magnetic waves are not disturbed and influenced, and meanwhile, good connection performance is achieved.