Compact planar-processed package for multichannel, fiber-optic computer interconnects

Monolithic arrays of AlGaAs lasers, GaAs OEICs (optoelectronic integrated circuits) and multimode optical fibers are becoming increasingly attractive for use in high-speed cost sensitive, short distance (<1 km) computer interconnections.1 However, for the technology to be pervasive, optoelectronic packaging, which today involves robotically aligned and assembled precision machined components, must be advanced, in favor of planar-processed packages, utilizing batch fabrication and assembly techniques, compatible with arrays of optoelectronic devices.