The ESA project PIOTS: setting up a complete pilot line for the packaging of photonic integrated circuits for space applications

Photonic Integrated Circuits (PICs) are expected to have a primary role for space applications in the years to come. The growing interest for the PICs for space applications lays in the fact the integrated photonics brings notable advantages as, among others: 1) Size, Weight and Power (SWaP) reduction 2) Removal/reduction of electromagnetic interferences 3) More flexibility (e.g. Network-on-chip) 4) Convergence with integrated electronics with potential costs reduction and improved performance (e.g. Beamforming) 5) Possibility to avoid optical to electronic to optical conversions (O-E-O) by maintaining some functions at photonic level in the optical domain, like for example in optical beamforming and photonics-based up- and down-conversion However, photonic packaging is less mature than its microelectronic counterpart. In fact, considering the great advancements in designing and fabricating integrated photonic chips, photonic packaging still represents a limiting factor and requires dedicated effort especially in view of a full exploitation of integrated photonics for Space applications. There is necessity to develop the proper packaging technologies compatible with the Space requirements as well the proper packaging line processes controls and documentations. PIOTS project aims to answer such demand by creating an end-to-end packaging pilot line that is strategically oriented to the demands of ESA and European space industry. This goal will be demonstrated through the realization of two test vehicles and the validation of manufacturing processes, equipment and techniques by means of an adequate Quality System implementation, including documentation and in-line controls as required to manufacture a product complying with requirements of the space sector. The paper will update on the project status focusing on the two test vehicles: TV1 - a hermetically packaged laser integrated with a SOI device TV2- a hermetically packaged SOI device with 8 in/out pigtailed fibers.