Package manufacturing method, piezoelectric vibrator, oscillator, electronic device and radio-controlled clock

Provided is a package manufacturing method by which an electronic component can be packaged in a cavity formed between a plurality of substrates bonded to each other. The method has a through electrode forming step of forming a through electrode, which penetrates a first substrate among the substrates in the thickness direction and permits a current to be carried between the inside of the cavity and the outside of the package. The through electrode forming step has a through hole forming step of forming a through hole on the first substrate for arranging the through electrode, and a filling step of filling the through hole with a filling material under depressurized atmosphere.