Quantitative study on removal of SU-8 photoresist patterns by supercritical CO2 emulsion

Supercritical CO"2 emulsion (SCE) was found to be effective in removal of epoxy-type SU-8 photoresist. The ability to remove SU-8 was compared between a commercially available Remover PG (RPG) solution and SCE. Both RPG and SCE were effective in removing not-hard-baked SU-8 dots, with height of [email protected] and diameter ranged from 50 to [email protected] When the SU-8 dots were hard-baked at 150^oC for 10min, RPG could not remove any of the SU-8 dots. On the other hand, SCE could still remove 42.11% of the [email protected] SU-8 dots. When the SU-8 dots were hard baked at 200^oC for 10min, 5.75% of the [email protected] SU-8 dots could be removed by SCE.