Physical Model for Power Supply Noise and Chip/Package Co-Design in Gigascale Systems with the Consideration of Hot Spots

2007 
An analytical physical model is derived for the first time to predict the first droop power supply noise for non-uniform current switching conditions and arbitrary functional block sizes. The model not only captures the impact of package parameters and the distributed nature of power grid and decoupling capacitance but also addresses the non-uniformity problem for the power density distribution brought by hot spots. A case study shows that both the frequency domain power noise model and the projected peak noise value have less than 1% error comparing with SPICE simulation.
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