Dynamic Strength of Pb-free Sn-Ag Based Solders

The dynamic compressive properties of Sn-Ag Pb-free solders have been studied by means of a split Hopkinson pressure bar at high strain rates. Tests were conducted at room temperature and under uniaxial compressive conditions. The dynamic mechanical properties and the effect of strain-rate on lead-free solder are discussed. And it is found that the dynamic yield stress of the solders largely falls into a linear relation to the strain rate in logarithm scales. Phenomenological constitutive relations were then established following Malvern theory.