Warpage Simulation and Optimization of Panel Level Fan-out Embedded Package

In this paper, the warpage of embedded packaging is studied through a comparative experiment. The effects of material properties of core material and EMC (Epoxy Molding Compound) on stress distribution packaging warpage was studied by finite element method simulation. The model suggests that the use of EMC with a CTE (Coefficient of Thermal Expansion) close to that of the chip and high elastic modulus could reduce the warpage.