Method of manufacturing a laminate and a method of making device structure using the laminate

A high heat resistance, to provide a film devices, and to provide a heat-resistant resin layer and the layer stack of inorganic material for this film device fabrication. A least a laminate comprising consist inorganic layer and the resin film and a method for manufacturing a film device using this laminate, (1) at least one surface of the inorganic layer at least step of the one side of the surface treating coupling agent (2) the coupling agent-treated inorganic layer, by performing UV irradiation treatment according to a predetermined pattern, and the inorganic layer step peel strength between the resin layer providing different portions. (3) the patterned resin to the coupling agent treatment surface on the inorganic layer solution or drying a coating solution layer obtained by applying a resin precursor solution, heat treatment step of forming the resin layer, Method for producing a laminate which comprises the steps of (1) to (3). And, after creating a device using this laminate, the step of UV exposure in accordance with a predetermined pattern from the inorganic substrate, to achieve the creation of film device by adhesion peel strength to the substrate to peel the weak. .BACKGROUND