The method of modifying the substrate bonding system and bonding system design

The present invention provides a wafer bonded to a substrate or carrier for the surface profile of the sheet may made by means of re-shaping, the height adjuster, the spacer increases, or by temperature controlled substrate regions obtained by the coupling system and modified bonding method modify system design. The substrate bonding system comprising: an upper member, wherein the upper member includes an upper body and the upper plate; and a lower member, wherein the lower member comprising: a lower plate, the lower body and a support structure for the lower body. Thus the sheet surface profile of the modified compensated impact may cause unevenness of the bonded substrate.