Electroless palladium plating from an ethylenediamine complex bath using phosphite as a reducing agent

SUMMARYElectroless palladium plating was investigated from palladium-ethylenediamine complex solutions containing sodium phosphite as a reducing agent.The deposition process proceeded autocatalytically as with hypophosphite, but the phosphorus content in the deposits was much lower.From the experimental results on solderability and electric contact resistance, it was suggested that electroless palladium plating could be utilized as an alternative to gold plating on electrical contacts and to solder or the preflux coat for ensuring good solderability.