Development of a jet-based Si micro-cooler with multiple drainage micro-trenches

Micro-fluid cooling solution is one of the most effective techniques for thermal management of high heat fluxes. A jet-based Si micro-cooler with multiple drainage micro-trenches has been developed for micro-electronic thermal management. An inlet/outlet flow arrangement layer has been introduced to achieve uniform pressure distribution for each nozzle. The effect of three types of arrangement structures on the hydraulic and thermal performance of the micro-cooer have been analyzed and compared using the fluid-solid coupling simulation models. The nozzle length effect and nozzle shape effect on the pressure variation inside cooler and the cooling capability have been studied. The test vehicle with the new nozzle/trench layer is fabricated using double-side DRIE process. The assembly of the stacked micro-cooler and the Si thermal test chip is finished using the two-steps optimized TCB process. With 0.05W pumping power for the micro-cooler, the heat dissipation capability of 260W/cm2 has been demonstrated, and the chip temperature can be maintained under 51°C. Excellent agreement has been obtained between experimental and simulation results. With the MDMT, fully developed jet impingement can be achieved for each nozzle, and uniform chip temperature distribution is obtained.