A New Algorithm for Die-to-Wafer-like Image Mask Inspection in Real Time

The effect of variations in defect printability must be considered in order to correctly evaluate mask defect inspection procedures. Because of nonlinear transfer effects and strong dependence of printability on defect types, it is difficult to define the boundary between real defect and false defect. To overcome this problem we developed a new algorithm for die-to-wafer-like image (D-to-WI) inspection in real time. This inspection method compares the die (wafer image calculated from CAD data) with the wafer-like image (WI) calculated from the mask image detected by the mask inspection system.