The Effect of Laser Sintering Process Parameters on Cu Nanoparticle Ink in Room Conditions
2013
Copper is an interesting
material for printed electronics inks because, for example, of its good
conductivity and lower raw material price compared to silver. However,
post-processing Cu inks is challenging because of non-conductive copper oxide.
In this work, inkjet-printed Cu nanoparticle structures were sintered on a
polyimide substrate with a continuous-wave 808-nm diode laser. Laser sintering
was tested by varying the sintering parameters (optical power and scanning
velocity), and the electrical resistance of the samples was measured. A minimum
sheet resistance of approx.90 mΩ/□
was obtained. All tests were run in room conditions. Sintered structures were
then analyzed from SEM images. Results showed that laser sintering produces
good repeatability, that a scanning velocity increment positively affects the
process window, and that multiple sintering cycles do not increase
conductivity.
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