Substrate support having a symmetrical feed structure

Apparatus for processing a substrate is disclosed herein. In some embodiments, the substrate support has a support surface for supporting the substrate, and a substrate support having a central axis, when the substrate is placed on a supporting surface, the RF power to the substrate in order to supply a first electrode disposed on the substrate support body, around the center of the surface of the first electrode facing the supporting surface, an inner conductor coupled to the first electrode, the inner conductor, a cylindrical, outwardly from the first electrode surrounding the parallel central axis to the central axis, an inner conductor extending in a direction away from the support surface of the substrate support, which is disposed around the inner conductor and the conductor is disposed between the inner and outer conductors may include an outer dielectric layer electrically insulates the outer conductor from the inner conductor. Outer conductor may be coupled to electrical ground.