Micromechanical Combined sensor arrangement and a corresponding production method

The present invention provides a micromechanical Combined sensor arrangement and a corresponding manufacturing method. The micromechanical combination sensor assembly includes an interposer chip (1; 1 '; 1' '; 1' ''; 1 '' ''; 1 '' '' ') having a first front side (V1; V1', V1 ''; V1 '' ', V1' '' ';'; R1 'V1' '' '') and a first rear panel (R1; R1 ', R1' ', R1' '' R1 '' '' '' ') having first electrical contacts (B) on the first front side ( 'V1'; '; V1' V1 V1 'V1' '' ''; V1 '' '' ') and second electric contacts (A1, A2) on ', wherein the interposer chip (1; 1 of the first rear panel (R1' '' ';'; R1 ';'; R1 'R1 R1' R1 '' '' ')'; 1 ''; 1 '' ' 1 '' ''; 1 ')' '' 'having first electrical vias (DK1, DK2) that electrically connect the first electrical contacts (B) with the second electrical contacts (A1, A2); and a micromechanical sensor arrangement (1a; 1a ', 1a' ') having a second front face (V1a, V1a', V1a '') and a second rear side (1a; 1a ', 1a' ') having at least one first sensor means (1a1; 1a1 '') and a second sensor means (1a2, 1a2 ') which are laterally adjacent, wherein the first front side (V1; V1', V1 '', V1 '' ', V1' '' '; V1' '' ' 1a2 ') electrically and mechanically (at the first electrical contacts;' is attached), that said first sensor means (1a1, 1a1 ', V1a'; 'V1a) in such a way (on the second front V1a' ') and said second sensor means (1a2 B) is connected.