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Wafer-Level Vacuum Packaged X and Y Axis Gyroscope Using the Extended SBM Process for Ubiquitous Rob
Wafer-Level Vacuum Packaged X and Y Axis Gyroscope Using the Extended SBM Process for Ubiquitous Rob
2008
Byoung-Doo Choi
Seung Joon Paik
Sangmin Lee
Hyoungho Ko
Kwangho Yoo
Nam-Kuk Kim
Dong-il Dan Cho
Keywords:
Wafer
Electronic engineering
Engineering
Gyroscope
Electrical engineering
Mechanical engineering
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