A case for 2-body material removal in prime LED sapphire substrate lapping and polishing

Abstract An alternative, and potentially better, means to process prime LED sapphire wafers is proposed. A brief history of material removal mechanisms suggests that brittle materials can be abraded in a ductile regime and that this can be a superior mode of removal. Advantages in material removal rate, surface finish and subsurface damage for a 2-body ductile removal of sapphire are shown relative to 3-body material removal. A major difficulty with this approach may be getting the LED manufacturing industry to understand that the appearance of the sapphire surface is quite different, unfamiliar yet predictable. Finally, some potential alternative process approaches are discussed that utilize 2-body material removal.