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Wafer-Level Parylene Temporary Packaging Technology for MEMS Applications
Wafer-Level Parylene Temporary Packaging Technology for MEMS Applications
2011
Lianggong Wen
Kristof Wouters
Frederik Ceyssens
Ann Witvrouw
Bob Puers
Keywords:
Packaging engineering
Parylene
Wafer
Microelectromechanical systems
Materials science
Electronic engineering
Nanotechnology
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