Fast WLRC applications in foundry fabrication

New reliability test methods and structures are needed and applied in advanced microelectronic fabrication. This work provides in-depth discussions on the double-point gate oxide integrity (GOI) test, fast I-ramp electromigration (EM) test, and an innovative test pattern to verify the probe contact resistance (PCR) and to improve WLRC (wafer level reliability control) test effectiveness, accuracy, and stability.